Clean-Room Facilities

The cleanroom for the semiconductor technology processes

is supervised by Dr. Abbes Tahraoui.

The main device-fabrication systems are:

A laser-wirter for mask-fabrication

Device DWL66,

Resolution 0.7 micrometer

Photolithography:

Device: MBJ4,   UV 400,   Resolution: 0.7µm

            MA6,   DUV 248,  Resolution: 0.5µm

Responsible: W. Seidel, W. Anders

..................................................................................................

Nanoimprintlithography:

Device: MA6

in preparation

Responsible: W. Seidel

..................................................................................................

Dry etching:

Device: SI 591, RIE and DC

Gases: Ar, N2, O2, Cl2, SF6, CF4, BCl3

Responsible: W. Anders

.................................................................................................. 

Metallization:

Devices: B 30 and L560 thermical and e-beam evaporation

Metal: Al, Au, Ti, Pt, Cr:Ni, Au:Be, Au:Ge

Responsible: B. Drescher

..................................................................................................

Sputtering:

Device:L 440,  DC and RF,  HV, ZnO and SiO2

DC and RF, UHV, AlN and SiO2

Responsible: B. Drescher

.................................................................................................

Wet etching:

Chemical Lab

Responsible: N.N.