Monolithic Integration of Group-III Nitrides on Metallic TiN (MINT)
The MINT project develops a fully epitaxial semiconductor-on-metal platform by integrating GaN and AlN on conductive titanium nitride (TiN) thin films to enable novel and scalable (opto-)electronic devices. Using molecular beam epitaxy (MBE) and subsequent lateral overgrowth by metal-organic chemical vapor deposition (MOCVD), the team aims to grow high-quality GaN and AlN structures directly on refractory TiN electrodes. This approach simplifies device fabrication, enhances thermal management and light extraction, and opens the way toward advanced µLEDs, bulk acoustic wave devices, and industrially relevant integration on silicon substrates. The German–French collaboration funded through the ANR–DFG programme brings complementary expertise to tackle the challenges of monolithic semiconductor/metal integration for next-generation electronics and photonics.